• Skip to main content
  • Skip to secondary menu
  • Skip to footer

Technology Conferences

Technology Events Calendar

  • Technology Events Calendar
  • Add Your Technology Event
  • Market Reports
    • Technology Digest
  • About
    • How to Organize an Informal Tech Event
  • Contact
    • GDPR

CEVA’s 2018 Technology Symposium Series Coming to Taiwan, China and Japan

October 15, 2018 By admin

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced that its 2018 Technology Symposium Series will be the largest yet, expanding to include five locations in Asia, with more than one thousand engineers expected to be in attendance. This year, this free series of one day events focuses on realizing the potential of AI at the Edge and harnessing its benefits for next-generation embedded designs. It will also explore the latest IoT and cellular connectivity solutions, including 5G, cellular IoT, Bluetooth 5 and Wi-Fi 6 (802.11ax).

Register here: https://events.ceva-dsp.com/symposium-2018-en/ to attend at any of the following locations:

Hsinchu, Taiwan on October 29; Shenzhen, China on October 31; Shanghai, China on November 2; Beijing, China on November 5, and; Tokyo, Japan on November 7.

CEVA’s product specialists, ecosystem partners and leading industry experts will join together for a full day of visionary and technical sessions. Topics covered include:

Deep learning at the Edge – AI processing for any neural network-based application
Computer vision and depth sensing – enhancing camera-enabled applications in smartphones, drones, ADAS and surveillance
Voice user interfaces and speech recognition – enriched sound experience in wireless headsets and smart speakers
Long range cellular connectivity – including latest 5G, NB-IoT and Cat-M1 standards
Multi-standard IoT connectivity – using Bluetooth 5 and Wi-Fi 6 (802.11ax)
Following the sessions, attendees can interact with CEVA staff, customers and partners, and see a wide range of demonstrations and devices deploying these technologies in real-world use cases.

Partners and customers participating in this year’s Technology Symposium Series include Abilisense, Alibaba, Arcsoft, Artosyn, Autotalks, Catena, GMV, Huachang, Immervision, LIPS, Nextchip, Rockchip, Silentium, Socionext, and Tempow. Participants vary by location and are subject to change. For more information, visit: https://events.ceva-dsp.com/symposium-2018-en/.

About CEVA, Inc.
CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and cellular IoT enabled devices, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For connectivity, we offer the industry’s most widely adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi (Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac) and Wi-Fi 6 (802.11ax) up to 4×4). Visit us at www.ceva-dsp.com

Filed Under: Announcements

Footer

Recent Posts

  • Zip Forward Europe 2026, April 16, 2026, London
  • AI Summit: Operationalizing Intelligence and Driving Innovation, April 16, 2026, Woburn, Massachusetts
  • GTC 2026, March 16–19, San Jose
  • Taiwan’s AI Ecosystem Steps Into the Spotlight at NVIDIA GTC, March 16–19, 2026
  • COMPUTEX 2026, June 2–5, Taipei
  • 360° Mobility Mega Shows 2026, April 14–17, Taipei
  • Forrester CX Summit Series 2026: Amsterdam, New York, San Francisco
  • IAMPHENOM 2026, March 10–12, Pennsylvania Convention Center, Philadelphia
  • Billington State and Local CyberSecurity Summit, March 9–11, 2026, Washington, D.C.
  • Mobile World Congress (MWC) 2026 – 2–5 March, Barcelona, Spain

Media Partners

  • Market Analysis
  • Technologies.org
A Map Without Hormuz: Rewiring Global Oil Flows Through Fragmented Corridors
RoboForce’s $52 Million Raise Signals That Physical AI Is Moving From Demo Stage to Industrial Scale
The Hormuz Crisis: Winners and Losers in the Global Energy Shock
Zohran Mamdani’s Politics of Confiscation
Beyond Shipyards: Stephen Carmel’s Maritime Warning and the Hard Reality of Rebuilding an Oceanic System
GitLab 18.10 Pushes Agentic AI Further Into Everyday Software Work
Autoscience Lands $14M Seed Round to Build an Automated AI Research Lab
NetApp AIDE and the Rise of the Enterprise AI Data Stack at GTC 2026
Engineered Biofertilizers
Apple Introduces AirPods Max 2 with H2 Chip, Stronger Noise Cancellation, and Creator-Focused Features

Media Partners

  • Market Research Media
  • Cybersecurity Market
Kioxia’s Storage Gambit: Flash Steps Into the AI Memory Hierarchy
Mamdani Strangling New York
The Rise of Faceless Creators: Picsart Launches Persona and Storyline for AI Character-Driven Content
Apple TV Arrives on The Roku Channel, Expanding the Streaming Platform Wars
Why Attraction-Grabbing Stations Win at Tech Events
AI-Speed Warfare Comes to Cybersecurity: Booz Allen’s Vellox Suite Signals a Structural Shift
Cape Rebuilds the Mobile Carrier from Scratch, Raises $100M to Turn Privacy into Infrastructure
Semgrep Pushes Deeper Into AI-Native AppSec
Cloaked Bets Big on AI-Driven Privacy as $375 Million Raise Signals a Shift in Digital Power
Discern Security Pushes Cybersecurity Into the Agentic Era Ahead of RSA Conference 2026

Copyright © 2022 TechnologyConference.com

Media Partners: Technologies, Market Analysis & Market Research and Exclusive Domains, Photography