• Skip to main content
  • Skip to secondary menu
  • Skip to footer

Technology Conferences

Technology Events Calendar

  • Technology Events Calendar
  • Add Your Technology Event
  • Market Reports
    • Technology Digest
  • About
    • How to Organize an Informal Tech Event
  • Contact
    • GDPR

EPE 2009, European Power Electronics and Applications Conference, September 8 – 10, 2009, Barcelona, Spain

April 25, 2009 By admin

EPE 2009, the European Power Electronics and Applications Conference in Barcelona, sponsored by the EPE Association and the National Organizing Committee, will take place on September 8 – 10, in the Palau de Congressos / Fira de Barcelona, Barcelona, Spain.

The conference includes six parallel lecture sessions where about 150 papers will be presented covering all areas related to Power Electronics, three dialogue sessions allowing face-to-face discussion with the authors, different workshops in power electronics, power systems and education and panel discussions on state-of-the-art topics. Fields like new devices, automotive, custom power systems and adjustable speed drives will be on the focus of the conference. Advances in Energy Conversion and Conditioning Technologies (ECCT), exploiting new power electronic systems, energy conversion devices and system control regimes, are all crucial to the development of the clean, efficient and sustainable technology of the future.

EPE 2009 will offer, co-organised with ECPE, state-of-the-art keynotes and several industrial sessions, running in parallel with the regular conference sessions, with invited presentations from industry world leaders as well as from relevant academic institutions and round table meetings to discuss in depth and focus on future developments in new or emerging topics as well as advanced industrial applications, of special interest to the power electronics community.

Active and Passive Components will be discussed on the first day of the Conference. The day will begin with a keynote presentation, coming from the University of Bremen on the state-of-the-art and future of wide gap devices. After the keynote, industrial sessions will highlight high frequency semiconductors for industrial power, with contributions from Infineon, Cree and Mitsubishi, high power semiconductors for industrial power, with speakers from Siemens, ABB and Infineon Tech, and bipolar, passives and related topics with contributions from In-Power Systems, Epcos and Semikron. The first Conference day will end with an invited lecture, coming from the Technical University of Chemnitz, on: design for reliability with IGBT-modules and a round Table on the topic of the day.

Mass Transportation Technologies presentations will happen on the second Conference day. Two keynotes speeches are planned, the first one coming from the University of Nottingham and devoted to the more electrical aircraft, and its future technologies and the second one from the Technical University of Munich related to hybrid electrical vehicle, heavy duty, fuel economy and hybridization factor. The following industrial presentations will cover the more electrical aircraft systems with speeches from Rolls-Royce, Liebherr and GE Aviation, advanced railway systems, with presentations coming from Siemens, Alstom Transport and Shinkansen R&D, and the more electrical ship technologies with contributions from Converteam, Ingeteam and Wartsila. The invited presentation of the afternoon, conducted by ECPE, will discuss reliability of power electronics systems and end the second Conference day industrial sessions with the corresponding Round Table discussion.

Technologies for Solar Power are the subject on the third Conference day. After a keynote, coming from the ISE Fraunhofer Institute, covering the topic of extreme efficiency PV-power converters, high power density PVconverters, with contributions from Altran, SMA and the Fraunhofer Institute for Solar Energy Systems ISE, will be presented followed by presentations related to the grid of the future coming from the University of Nottingham, the University of Kassel and Saft Baterias S.L. The third day industrial sessions will end with an invited presentation on The Future of High Power Electronics in Transmission and Distribution Systems conducted by Areva -TD and the corresponding round table on the topic of the day.

www.epe2009.com

Filed Under: Announcements Tagged With: EPE 2009, European Power Electronics and Applications Conference

Footer

Recent Posts

  • Technology Investor Conference Circuit, May–June 2026
  • Automate 2026 Sets Its Agenda Around AI’s Role in Industrial Transformation, June 22–25, 2026, McCormick Place in Chicago
  • IBM Think 2026, May 5–8, Boston, Massachusetts, USA
  • AI & Creativity Summit New York 2026, May 14, The Lighthouse Brooklyn
  • SEMICON Southeast Asia 2026, May 5–7, Kuala Lumpur
  • SID Display Week 2026, May 3–8, Los Angeles Convention Center
  • Big Dipper Innovation Summit, May 12–14, 2026, Richmond
  • RISC-V Summit Europe 2026, June 8–12, Bologna, Italy
  • Data Center World 2027, May 24–27 2027, Music City Center, Nashville, Tennessee
  • Snowflake Summit 26, June 1–4, 2026, San Francisco

Media Partners

  • API Coding
  • App Coding
  • S3H.com
Why Private Domain Data Is the Real Key to AI That Actually Works
Orkes Raises $60M to Bring Production-Grade AI Orchestration to Enterprise Developers
Form.io Launches MCP Server and Agentic Coding Toolset for Governed Enterprise AI Development
Appdome Upgrades MobileBOT Defense With Identity-First Mobile API Protection
Five SDK Generators Compared: Speakeasy, Stainless, Fern, APIMatic, and OpenAPI Generator
API Monetization Models That Work and the Ones That Drive Developers Away
gRPC in Production: What the Documentation Doesn't Tell You
Event-Driven Architecture vs Request-Response: Choosing the Right Communication Pattern
The Business Case for Internal APIs That Most Engineering Leaders Ignore
Breaking Changes: How to Avoid Shipping Them and What to Do When You Must
DigitalOcean Launches AI-Native Cloud at Deploy 2026
Verdent Updates AI Platform to Function as a Full Engineering Team for Solo Builders
The Side Project App Is Not Dead. The Side Project App Business Is.
The App Monetization Landscape Has Changed and Most Teams Have Not Caught Up
Building Offline-First Mobile Apps Is Harder Than It Looks and Worth It
State Management in React Native Has Too Many Options and One Right Answer
Mobile Accessibility Is the Case Developers Keep Ignoring
Testing Mobile Apps at Scale Without Losing Your Mind
App Store Optimization in 2026 Is a Different Game Than It Was
Cross-Platform vs Native: The Honest Assessment Nobody Gives You
11% Is Not a Bug. It's the Starting Gun.
The DevOps Job Isn't Dead. It's Being Repriced.
Is Agile Software Development Dead in the Age of AI?
ServiceNow Brings AI-Native Platform to Manufacturing Value Chain
Systal Named Leader in Gartner Magic Quadrant for Managed Network Services
Infor and AWS Deploy Industry-Specific AI Agents for Manufacturing at Scale
Kyndryl Named Leader in Three Mainframe Categories in 2026 ISG Provider Lens Report
We Are Likely in the Early Stages of Another Productivity Boom
Hardware Asset Management Is the IT Discipline Most Organizations Do Badly
Low-Code Platforms Have Found Their Ceiling

Media Partners

  • Technologies.org
  • Blockchaining.org
  • Cybersecurity Market
Quantum Motion Raises $160 Million Series C to Scale Silicon-Based Quantum Computing
Fazeshift Raises $17 Million Series A to Automate Accounts Receivable With Autonomous AI Agents
Instant Power Becomes the Next AI Infrastructure Battleground as Nyobolt Raises $60 Million
NVIDIA and Corning Expand U.S. Optical Manufacturing for AI Infrastructure
QuantWare Raises $178 Million Series B, Announces 10,000-Qubit Processor Architecture
Panthalassa Raises $140 Million to Power AI Computing with Ocean Waves
JEDEC Advances DDR5 MRDIMM Architecture With New MDB Standard and Next-Gen Memory Roadmap
Hydrogen Embrittlement and Pipeline Infrastructure: The Metal Problem No One Wants to Talk About
Hydrogen Policy in the United States: Decades of Investment, Uncertain Direction
Hydrogen and Grid Resilience: The Long-Duration Storage Problem
a16z Crypto Raises $2.2B for Fund 5, Half the Size of Its 2022 Peak
Blockchain Technology in the Aerospace and Defense Market
Taiwan Considers Bitcoin Reserve Debate After Legislative Presentation
Blockchain.com Launches Blockchain Wealth, a Private Banking Tier for Crypto's High-Net-Worth Class
Squads Raises $18M to Build Altitude, a Financial OS on Stablecoin Rails
Visa Launches Validator Node on Tempo Blockchain Network
Liquid Raises $18M Seed Round to Build a Single Platform for 24/7 Cross-Asset Trading
Paystand Launches USDb, a Bitcoin-Aligned Stablecoin Built for Enterprise Finance
Cold Wallet Users Are Traders, Not Just Holders, Tangem Research Finds
MoonPay and Korean Partners Acquire Finger to Build Won Stablecoin Infrastructure
ShinyHunters Breaches Canvas LMS, Threatening Data on 275 Million Users
NETSCOUT FY2026: Revenue Growth, Margin Expansion, and a Balance Sheet That Tells the Real Story
Day Zero Threat Research Summit, August 30–September 1, 2026, Las Vegas
AI Agent Security Summit, May 27, 2026, San Francisco
General Analysis Raises $10 Million to Secure the Fast-Rising World of AI Agents
Black Hat Asia 2026, Singapore: Cybersecurity Event Highlights AI Threats and Data Sovereignty
Aptori Expands Runtime-Driven Validation Platform for the AI Coding Era
Rilian Raises $17.5 Million to Bring Agentic AI Into Cybersecurity and Sovereign Defense
ServiceNow Completes $7.75 Billion Armis Acquisition, Expands AI Security Ambitions
Enterprise WiFi Security: Where Convenience Stops and Control Begins

Copyright © 2022 TechnologyConference.com

Media Partners: Technologies · Market Analysis · Market Research · Exclusive Domains · Photography · Referently · Transportational · Renewability