SEMICON West runs October 13 to 15 at the Moscone Center in San Francisco, and it’s the last time it will. In July, SEMI announced that North America’s flagship chip-industry show is moving to Phoenix for good and switching to spring dates: March 30 to April 1, 2027 at the Phoenix Convention Center, then May 9–11, 2028 and April 3–5, 2029.
SEMI gives two reasons. A spring slot clears the calendar around SEMICON India, Taiwan, Europa and Japan, and Phoenix is where the money has gone, with more than $200 billion of semiconductor investment in the area since 2020. Phoenix hosted the show for the first time in 2025, so for Bay Area companies this October is the last edition on home turf.
The 2026 program centers on AI and on advanced packaging and heterogeneous integration, with smart manufacturing, sustainability and workforce close behind, and quantum computing and photonics added. The CEO Summit and the Advanced Packaging & Heterogeneous Integration Summit are the set pieces. On the floor, Teradyne (booth #1143) is showing Titan HP, its system-level test platform, now with burn-in that holds each AI accelerator at its own junction temperature under a real workload.
The show overlaps with the International Test Conference in San Antonio, October 11 to 16, which matters if you work in test. For the rest of the supply chain, from equipment and materials makers to fabless designers, it’s a goodbye to Moscone. Next time it’s Phoenix, in spring.